By Philip Edelbrock, Christian Zuckschwerdt, Burkart Lingner,
Jean Delvare, Trent Piepho and others
Decoding EEPROM | 4-0051 | 4-0053 |
Guessing DIMM is in | bank 2 | bank 4 |
SPD EEPROM Information | ||
EEPROM CRC of bytes 0-125 | OK (0x328C) | |
# of bytes written to SDRAM EEPROM | 384 | |
Total number of bytes in EEPROM | 512 | |
Fundamental Memory type | DDR4 SDRAM | |
SPD Revision | 1.0 | |
Module Type | UDIMM | |
EEPROM CRC of bytes 128-253 | OK (0x27DE) | |
Memory Characteristics | ||
Maximum module speed | 2400 MHz (PC4-19200) | |
Size | 8192 MB | |
Banks x Rows x Columns x Bits | 16 x 15 x 10 x 64 | |
SDRAM Device Width | 8 bits | |
Ranks | 2 | |
Rank Mix | Symmetrical | |
AA-RCD-RP-RAS (cycles) | 16-16-16-39 | |
Supported CAS Latencies | 25T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T, 9T | |
Timings at Standard Speeds | ||
AA-RCD-RP-RAS (cycles) as DDR4-2400 | 16-16-16-39 | |
AA-RCD-RP-RAS (cycles) as DDR4-2133 | 15-15-15-35 | |
AA-RCD-RP-RAS (cycles) as DDR4-1866 | 13-13-13-31 | |
AA-RCD-RP-RAS (cycles) as DDR4-1600 | 11-11-11-26 | |
Timing Parameters | ||
Minimum Cycle Time (tCKmin) | 0.833 ns | |
Maximum Cycle Time (tCKmax) | 1.500 ns | |
Minimum CAS Latency Time (tAA) | 13.328 ns | |
Minimum RAS to CAS Delay (tRCD) | 13.328 ns | |
Minimum Row Precharge Delay (tRP) | 13.328 ns | |
Minimum Active to Precharge Delay (tRAS) | 32.375 ns | |
Minimum Active to Auto-Refresh Delay (tRC) | 45.703 ns | |
Minimum Recovery Delay (tRFC1) | 260.000 ns | |
Minimum Recovery Delay (tRFC2) | 160.000 ns | |
Minimum Recovery Delay (tRFC4) | 110.000 ns | |
Minimum Four Activate Window Delay (tFAW) | 21.000 ns | |
Minimum Row Active to Row Active Delay (tRRD_S) | 4.165 ns | |
Minimum Row Active to Row Active Delay (tRRD_L) | 5.831 ns | |
Minimum CAS to CAS Delay (tCCD_L) | 5.356 ns | |
Other Information | ||
Package Type | Monolithic | |
Maximum Activate Count | Unlimited | |
Post Package Repair | Not supported | |
Module Nominal Voltage | 1.2 V | |
Thermal Sensor | No | |
Physical Characteristics | ||
Module Height | 32 mm | |
Module Thickness | 2 mm front, 2 mm back | |
Module Reference Card | B revision 0 | |
Manufacturer Data | ||
Module Manufacturer | Corsair | |
DRAM Manufacturer | Micron Technology | |
Part Number | CMK16GX4M2A2400C16 |
Number of SDRAM DIMMs detected and decoded: 2